ADuM2250/ADuM2251 为热插拔数字隔离器，内置非闩锁双向通信通道，且与I2C接口兼容。这样就不需要将I2C信号分成单独的发送信号与接收信号，供独立光电耦合器使用。

ADuM2250提供两个双向通道，支持完全隔离的I2C接口。ADuM2251提供一个双向通道和一个单向通道，适合不需要双向时钟的应用。

ADuM2250/ADuM2251 均内置热插拔电路，可防止将无源卡插入有源总线时产生数据干扰。

这些隔离器都采用ADI公司的 iCoupler 芯片级变压器技术。iCoupler 是磁隔离技术，其功能、性能、尺寸和功耗均优于光电耦合器。ADuM2250/ADuM2251将 iCoupler 通道与半导体电路集成，在小型封装中实现完全隔离的 I2C 接口。

应用

• I2C、 SMbus或PMBus 接口隔离
• 多级I2C接口
• 电源
• 网络
• 以太网供电

• 双向I2C通信
• 开漏接口
• 适合热插拔应用
• 30 mA 吸电流能力
• 工作频率：1000 KHz
• 电源电压/逻辑电平：3.0 V至5.5 V
• 16引脚宽体SOIC封装版本(RW-16)
• 16引脚宽体SOIC封装版本，增强爬电距离(RI-16-2)

• 工作温度最高可达105°C
• 安全和法规认证
• UL认证： 依据UL 1577，1分钟5000 V rms
• 1分钟5000 Vrms，符合UL 1577
• CSA元件验收通知5A（RI-16-2封装）

ADUM2251ARIZ，封装：16-Lead SOIC (Increased Creepage)，包装形式及数量：管装，37，工作温度：-40 to 105C，AD官网报价：3.6（100-499个）；3.19（1000+个）

ADUM2251ARIZ-RL，封装：16-Lead SOIC (Increased Creepage)，包装形式及数量：卷带，1000，工作温度：-40 to 105C，AD官网报价：3.6（100-499个）；3.19（1000+个）

ADUM2251ARWZ，封装：16-Lead SOIC Wide，包装形式及数量：管装，47，工作温度：-40 to 105C，AD官网报价：3.6（100-499个）；3.19（1000+个）

ADUM2251ARWZ-RL，封装：16-Lead SOIC Wide，包装形式及数量：卷带，1000，工作温度：-40 to 105C，AD官网报价：3.6（100-499个）；3.19（1000+个）

ADUM2251WARWZ，封装：16-Lead SOIC Wide，包装形式及数量：管装，47，工作温度：-40 to 125C，AD官网报价：4.51（100-499个）；3.98（1000+个）

ADUM2251WARWZ-RL，封装：16-Lead SOIC Wide，包装形式及数量：卷带，1000，工作温度：-40 to 125C，AD官网报价：4.51（100-499个）；3.98（1000+个）

EVAL-ADuM1250：ADuM1250 Evaluation Board

The EVAL-ADuM1250EBZ supports two bidirectional channels for evaluation of isolated I2C interfaces in 8-lead SOIC packages. The evaluation board provides a JEDEC standard, 8-lead SOIC_N pad layout. This layout supports signal distribution, loopback, and loads referenced to the VDDx or GNDx planes, as well as optimal bypass capacitance. Signal sources can be conducted to the board through header pins or through edge mounted Sub- miniature Version A (SMA) connectors (SMA connectors must be ordered separately).

Screw terminal blocks on the evaluation board provide power connections. The board includes 200 mil (5.08 mm) header positions for compatibility with active probes (probe header pins must be ordered separately). The EVAL-ADuM1250EBZ evaluation board can be used to evaluate the ADuM1250, ADuM1251, ADuM2250, and ADuM2251 devices. Although the pad layout on the EVAL- ADuM1250EBZ does not support the ADuM2250 and ADuM2251 16-lead SOIC_W and SOIC_IC packages, these devices are functionally equivalent to the ADuM1250 and ADuM1251, respectively, for the purposes of evaluation. They differ only by package and isolation capabilities. Therefore, evaluations of the ADuM1250 and ADuM1251 can be applied to the ADuM2250 and ADuM2251 as well.

The evaluation board follows best printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. No other electromagnetic interference (EMI) or noise mitigation design features are included on this evaluation board. For high speed operation, or when ultralow emissions are required, refer to the AN-1109 Application Note for additional evaluation board layout techniques.

Full specifications for the ADuM1250 are available in the ADuM1250 data sheet, which must be consulted in conjunction with User Guide UG-1100 when working with the evaluation board.