The ADPA7009-2 is a gallium arsenide (GaAs), pseudomorphic high-electron-mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 0.5 W power amplifier with an integrated temperature-compensated, on-chip power detector that operates between 20 GHz and 54 GHz. The amplifier provides a gain of 17.5 dB, an output power for 1 dB compression (OP1dB) of 28 dBm, and a typical output third-order intercept (OIP3) of 34.5 dBm at 20 GHz to 35 GHz. The ADPA7009-2 requires 850 mA from a 5 V supply voltage (VDDx). The RF input and outputs are internally matched and DC-blocked for ease of integration into higher level assemblies. Most of the typically required external passive components for operation (AC coupling capacitors and power supply decoupling capacitors) are integrated, which facilitates a small, compact printed circuit board (PCB) footprint. The ADPA7009-2 is available in a 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package.

APPLICATIONS

• Military and space
• Test instrumentation

• Integrated power-supply capacitors and bias inductors
• Integrated AC coupling capacitors
• Gain: 17.5 dB typical at 20 GHz to 35 GHz
• Input return loss: 14 dB typical at 20 GHz to 35 GHz
• Output return loss: 15 dB typical at 20 GHz to 35 GHz
• OP1dB: 28 dBm typical at 20 GHz to 35 GHz

• PSAT: 28.5 dBm typical at 20 GHz to 35 GHz
• OIP3: 34.5 dBm typical at 20 GHz to 35 GHz
• Noise figure: 7.5 dB typical at 20 GHz to 35 GHz
• 5 V supply voltage at 850 mA
• 50 Ω matched input and output
• 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package

ADPA7009-2ACEZ，封装：24-terminal LGA_CAV (15 mm x 15 mm x 1.60 mm)，包装形式及数量：托盘，1，工作温度：-40 to 85C，AD官网报价：

ADPA7009-2ACEZ-R7，封装：24-terminal LGA_CAV (15 mm x 15 mm x 1.60 mm)，包装形式及数量：卷带，500，工作温度：-40 to 85C，AD官网报价：

EVAL-ADPA7009-2：Evaluating the ADPA7009-2 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier

The ADPA7009-2-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA7009-2 as well as mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 1.85 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA7009-2-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7009.

RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

The power supply decoupling capacitors shown in Figure 4 of the user guide represent the configuration that was used to characterize and qualify the device. It is possible to reduce the number of capacitors; however, this reduction varies by system. It is instead recommended to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA7009 data sheet in conjunction with the user guide when working with the ADPA7009-2-EVALZ board.