ADPA7006CHIP 是一款砷化镓 (GaAs) 假晶高电子迁移率晶体管 (pHEMT) 单片微波集成电路 (MMIC) 分布式功率放大器，工作频率范围为 18 GHz 至 44 GHz。该放大器提供 23.5 dB 的小信号增益、1 dB 增益压缩时 29 dBm 的输出功率和 38 dBm 的典型输出 3 阶交调点。ADPA7006CHIP 要求在电源电压 (VDD) 上通过 5 V 电源提供 800 mA 的电流，具有可在内部匹配 50 Ω 的输入和输出，便于集成到多芯片模块 (MCM) 中。所有数据均由通过两个短于 0.31 mm 的 0.025 mm 线焊连接的芯片进行采集。

应用

• 军用和航空航天
• 测试仪器仪表
• 通信

• 输出 P1dB：29 dBm
• PSAT：29.5 dBm
• 增益：23.5 dB
• 输出 IP3：38 dBm

• 电源电压：5 V (800 mA)
• 集成功率检测器
• 50 Ω 匹配输入/输出
• 裸片尺寸：2.750 mm × 1.805 mm × 0.102 mm

ADPA7006AEHZ，封装：6-Lead LCC (6mm x 6mm x 1.32mm w/EP)，包装形式及数量：Cut Tape,500，工作温度：-40 to 85C，AD官网报价：150.3（100-499个）；141.41（1000+个）

ADPA7006AEHZ-R7，封装：6-Lead LCC (6mm x 6mm x 1.32mm w/EP)，包装形式及数量：卷带，500，工作温度：-40 to 85C，AD官网报价：150.3（100-499个）；141.41（1000+个）

ADPA7006C-KIT，封装：CHIPS OR DIE，包装形式及数量：托盘，2，工作温度：-55 to 85C，AD官网报价：285.01（100-499个）；285.01（1000+个）

ADPA7006CHIP，封装：CHIPS OR DIE，包装形式及数量：托盘，25，工作温度：-55 to 85C，AD官网报价：130.76（100-499个）；122.65（1000+个）

EVAL-ADPA7006：ADPA7006 Evaluation Board

The ADPA7006-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 10 mil thick, Rogers 4350B, copper clad mounted to an aluminum heat sink. The heat sink provides thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management.

The RFIN and RFOUT ports on the ADPA7006-EVALZ are populated by 2.9 mm, female coaxial connectors. The respective RF traces of the ports have a 50 ? characteristic impedance. The ADPA7006-EVALZ is populated with components suitable for use over the entire ?40°C to +85°C operating temperature range of the device. To calibrate evaluation board trace losses, a through calibration path is provided between the J3 and J4 connectors. J3 and J4 must be populated with RF connectors to use the through calibration path. See Table 1 and Figure 3 for the through calibration path performance.

The power, ground, gate control voltages, and detector output voltages are accessed through two 8-pin headers (see Table 1).

RF traces are 50 ? grounded, coplanar waveguide. Package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the ADPA7006-EVALZ represent the configuration used to characterize and qualify the device. It is possible to reduce the number of capacitors with a scope, but the scope varies from system to system. It is recommended to first remove or combine the largest capacitors that are farthest from the device.

For more information about the ADPA7006, refer to the ADPA7006 data sheet. Consult the data sheet in conjunction with this user guide when using the ADPA7006-EVALZ evaluation board.